Nanoelectronics & Packaging Laboratory

Current packaging research is focused on the replacement of traditional lead-alloy solders, by no-lead solders (Yi) or electrically conductive adhesives (Morris), but is moving into the new and challenging area of packaging of nanoelectronics technologies. The nanoelectronics research covers the fabrication and test of single electron transistors, and related fundamental studies of nanoparticle arrays. The laboratory houses a Quesant 500 Atomic Force Microscope, a Moire Interferometer for the measurement of very small deflections, ultra-low current measurement capability, and a range of semiconductor fabrication and packaging research equipment (primarily donated by local industry).